• DocumentCode
    1188834
  • Title

    Effect of thermal annealing on radiation-induced degradation of bipolar technologies when the dose rate is switched from high to low

  • Author

    Ducret, S. ; Saigné, F. ; Boch, J. ; Schrimpf, R.D. ; Fleetwood, D.M. ; Vaille, J.R. ; Dusseau, L. ; David, J.P. ; Ecoffet, R.

  • Author_Institution
    Univ. de Montpellier, France
  • Volume
    51
  • Issue
    6
  • fYear
    2004
  • Firstpage
    3219
  • Lastpage
    3224
  • Abstract
    The influence of an electrostatic barrier in the oxide bulk on the radiation-induced degradation of bipolar technologies is investigated by performing a thermal annealing operation before switching the dose rate from high to low. It is shown that, in our test conditions, no significant electrostatic barrier effect is at play in the device degradation.
  • Keywords
    annealing; bipolar integrated circuits; bipolar transistors; dosimetry; integrated circuit testing; radiation effects; bipolar integrated circuits; bipolar technologies; electrostatic barrier; enhanced low dose rate sensitivity; high dose rate; oxide bulk; radiation-induced degradation; thermal annealing; Annealing; Electrostatics; Helium; Impedance; Paper technology; Protons; Shape; Switches; Testing; Thermal degradation;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2004.839145
  • Filename
    1369473