• DocumentCode
    118889
  • Title

    Research of surface wettability of plating on the ceramic shell

  • Author

    Dongmei Li ; Xiaocheng Feng ; Jinchun He ; Binhao Lian ; Yong Wang

  • Author_Institution
    Beijing MXTronics Corp., Beijing, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1208
  • Lastpage
    1211
  • Abstract
    The wettability of coating surface has important significance in the spreading situation of piece of sticky piece, and the welding state of Au-Sn solder. Wettability of solids is expressed with wetting contact angle. In this paper, by studying the wetting angles of the water droplets on the surface of the different ceramic shell, assess the wettability on the surface of the ceramic shell, and the ways to improve the wettability is proposed through experiments. The results of the experiment show that the presence of organic matter reduces the wettability of the coating surface, so the wetting angles of the coating surface are large in the analysis process. After the plasma cleaning, organics were washed subsequently, and the wettability of the surface coating increased, so the wetting angles are decreased.
  • Keywords
    ceramics; contact angle; electronics packaging; gold alloys; reliability; solders; tin alloys; wetting; Au-Sn; ceramic shell; organic matter; plasma cleaning; solder; solid wettability; surface coating wettability; water droplets; welding state; wetting contact angle; Coatings; Liquids; Solids; Surface cleaning; Surface morphology; Wettability; composition analysis; plasma cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922860
  • Filename
    6922860