DocumentCode
118889
Title
Research of surface wettability of plating on the ceramic shell
Author
Dongmei Li ; Xiaocheng Feng ; Jinchun He ; Binhao Lian ; Yong Wang
Author_Institution
Beijing MXTronics Corp., Beijing, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1208
Lastpage
1211
Abstract
The wettability of coating surface has important significance in the spreading situation of piece of sticky piece, and the welding state of Au-Sn solder. Wettability of solids is expressed with wetting contact angle. In this paper, by studying the wetting angles of the water droplets on the surface of the different ceramic shell, assess the wettability on the surface of the ceramic shell, and the ways to improve the wettability is proposed through experiments. The results of the experiment show that the presence of organic matter reduces the wettability of the coating surface, so the wetting angles of the coating surface are large in the analysis process. After the plasma cleaning, organics were washed subsequently, and the wettability of the surface coating increased, so the wetting angles are decreased.
Keywords
ceramics; contact angle; electronics packaging; gold alloys; reliability; solders; tin alloys; wetting; Au-Sn; ceramic shell; organic matter; plasma cleaning; solder; solid wettability; surface coating wettability; water droplets; welding state; wetting contact angle; Coatings; Liquids; Solids; Surface cleaning; Surface morphology; Wettability; composition analysis; plasma cleaning;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922860
Filename
6922860
Link To Document