DocumentCode
118893
Title
Physics-of-failure-based prognostics and health management for electronic products
Author
Decai Yang
Author_Institution
Sch. of Astronaut. & Aeronaut., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1215
Lastpage
1218
Abstract
A PHM (prognostics and health management) scheme for electronic product is proposed on the basis of physics-of-failure. This method can help online reliability evaluation under real environmental condition by the identification of potential failure mechanism and failure position for devices, products and systems, so as to establish the foundation of reliability assessment for new material, new structure and new product. Under the analysis of failure mechanism for electronic product, the FMMEA (Failure Modes, Mechanisms and Effects Analysis) is used to get the failure mode, mechanism and failure physics model for the potential fault site. Based on the simulation model derived from the parameters of product material, structure, processing technology and the analysis of stress, the life distribution for the potential fault can be got through damage analysis with physics-of-failure model. The PHM information derived can be used to maintain, prognostic and decision-making for electronic product to reduce the life cycle cost and enhance the availability.
Keywords
electronic products; failure analysis; reliability; stress analysis; FMMEA; PHM scheme; decision-making; electronic products; environmental condition; failure effect analysis; failure modes; failure position; life cycle cost; life distribution; online reliability evaluation; physics-of-failure-based prognostics-health management; potential failure mechanism; product material; reliability assessment; simulation model; stress analysis; Failure analysis; Fatigue; Logic gates; Materials; Prognostics and health management; Reliability; Stress; FMMEA; PHM; damage analysis; physics of failure; reliability prediction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922862
Filename
6922862
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