• DocumentCode
    118893
  • Title

    Physics-of-failure-based prognostics and health management for electronic products

  • Author

    Decai Yang

  • Author_Institution
    Sch. of Astronaut. & Aeronaut., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1215
  • Lastpage
    1218
  • Abstract
    A PHM (prognostics and health management) scheme for electronic product is proposed on the basis of physics-of-failure. This method can help online reliability evaluation under real environmental condition by the identification of potential failure mechanism and failure position for devices, products and systems, so as to establish the foundation of reliability assessment for new material, new structure and new product. Under the analysis of failure mechanism for electronic product, the FMMEA (Failure Modes, Mechanisms and Effects Analysis) is used to get the failure mode, mechanism and failure physics model for the potential fault site. Based on the simulation model derived from the parameters of product material, structure, processing technology and the analysis of stress, the life distribution for the potential fault can be got through damage analysis with physics-of-failure model. The PHM information derived can be used to maintain, prognostic and decision-making for electronic product to reduce the life cycle cost and enhance the availability.
  • Keywords
    electronic products; failure analysis; reliability; stress analysis; FMMEA; PHM scheme; decision-making; electronic products; environmental condition; failure effect analysis; failure modes; failure position; life cycle cost; life distribution; online reliability evaluation; physics-of-failure-based prognostics-health management; potential failure mechanism; product material; reliability assessment; simulation model; stress analysis; Failure analysis; Fatigue; Logic gates; Materials; Prognostics and health management; Reliability; Stress; FMMEA; PHM; damage analysis; physics of failure; reliability prediction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922862
  • Filename
    6922862