Microstructure and properties of Sn2.5Ag0.7Cu0.1RE lead-free soldering joints with ultrasonic assisted

Author

Yu-jie Liu ; Ke-ke Zhang ; Xiao-jiao Zhang ; Kai Zhao ; Ran-feng Qiu ; Hong-xin Shi

Author_Institution

Sch. of Mater. Sci. & Eng., Henan Univ. of Sci. & Technol., Luoyang, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

1233

Lastpage

1236

Abstract

Sn2.5Ag0.7Cu0.1RE/Cu solder joints were obtained with ultrasonic vibration assisted. Microstructure and properties of the joints were studied. Experimental results show that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux. The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time of 60 s, which increased by 35%. Compared with that of the solder joint obtained without external energy assisted, the application of ultrasonic vibration during soldering can decrease thickness and roughness of the interfacial Cu6Sn5 intermetallic compound, and the fracture mechanisms of the solder joints transforms from brittle fracture to mixed fracture, which is dominated as ductile fracture.

Keywords

copper alloys; ductile fracture; reliability; shear strength; silver alloys; soldering; tin alloys; ultrasonic applications; Sn_2.5Ag_0.7Cu_0.1; brittle fracture; ductile fracture; interfacial intermetallic compound roughness; interfacial intermetallic compound thickness; joint microstructure; joint properties; lead-free soldering joints; low-halogen flux; maximum shear strength; mixed fracture; soldering reliability; time 60 s; ultrasonic power condition; ultrasonic vibration assisted; ultrasonic vibration time; Three-dimensional displays; Lead-free solder joint; Microstructure; Property; Ultrasonic wave;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922866

Filename

6922866