DocumentCode
1189501
Title
Considering Solder Connections, Does Triplicated Majority Voting Apply to Integrated Circuits
Author
Goldman, Herbert D. ; Rom, J.
Author_Institution
IEEE
Issue
10
fYear
1968
Firstpage
990
Lastpage
992
Abstract
Abstract—A procedure for incorporating the deleterious effect of solder connections into reliability calculations for integrated circuits is presented. This is incorporated into a study concerning the advisability of applying triplicated majority voting to integrated circuits.
Keywords
Index Terms—Error reduction factor, integrated circuit, reliability, solder connections, triplicated majority voting.; Costs; Digital integrated circuits; Integrated circuit reliability; Materials reliability; Packaging; Probability; Protection; Read only memory; Redundancy; Voting; Index Terms—Error reduction factor, integrated circuit, reliability, solder connections, triplicated majority voting.;
fLanguage
English
Journal_Title
Computers, IEEE Transactions on
Publisher
ieee
ISSN
0018-9340
Type
jour
DOI
10.1109/TC.1968.226449
Filename
1687246
Link To Document