Title :
Considering Solder Connections, Does Triplicated Majority Voting Apply to Integrated Circuits
Author :
Goldman, Herbert D. ; Rom, J.
Author_Institution :
IEEE
Abstract :
Abstract—A procedure for incorporating the deleterious effect of solder connections into reliability calculations for integrated circuits is presented. This is incorporated into a study concerning the advisability of applying triplicated majority voting to integrated circuits.
Keywords :
Index Terms—Error reduction factor, integrated circuit, reliability, solder connections, triplicated majority voting.; Costs; Digital integrated circuits; Integrated circuit reliability; Materials reliability; Packaging; Probability; Protection; Read only memory; Redundancy; Voting; Index Terms—Error reduction factor, integrated circuit, reliability, solder connections, triplicated majority voting.;
Journal_Title :
Computers, IEEE Transactions on
DOI :
10.1109/TC.1968.226449
