• DocumentCode
    118987
  • Title

    A novel compacted microstrip bandpass filter using stepped impedance resonator(SIR) and defected ground structure(DGS)

  • Author

    Zhili Li ; Wen Shi ; Ye Yuan

  • Author_Institution
    Sch. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    1338
  • Lastpage
    1340
  • Abstract
    This paper describes a novel compacted microstrip dual-mode bandstop filter realized using stepped impedance resonator (SIR) and defected ground structure (DGS) with tuningrange from 2.65 GHz to 3.85 GHz. The proposed filter is composed of three resonators :a folded half wavelength SIR resonator and a T-type stub-loaded resonator on the top layer and a defected ground structure (DGS) resonator in the ground plane. DGS is used for its property of miniaturizing the size of microwave filter and also improving the mutual coupling between the resonators. In addition, the transmission zeros at each passband skirts can be controlled by tuning the proposed resonators. This filter gives an insertion loss of -0.46 dB, a return loss of -27.5 dB with a center frequency around 3GHz. The experimental and 3D EM commercial software HFSS simulated results on the filter are presented and discussed and good agreements are obtained between its measured and simulated S-parameters.
  • Keywords
    S-parameters; band-pass filters; defected ground structures; microstrip filters; microwave filters; resonator filters; 3D EM commercial software HFSS; DGS resonator; SIR; T-type stub-loaded resonator; compacted microstrip bandpass filter; compacted microstrip dual-mode bandstop filter; defected ground structure resonator; folded half wavelength SIR resonator; frequency 2.65 GHz to 3.85 GHz; ground plane; insertion loss; loss -0.46 dB; loss -27.5 dB; measured S-parameter; microwave filter; mutual coupling; passband skirts; return loss; simulated S-parameter; stepped impedance resonator; top layer; transmission zeros; S-parameters; defected ground structure(DGS); dual-mode; sourceload coupling; stepped impedance resonator(SIR);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922895
  • Filename
    6922895