Technique of multi-temperature Stepped Welding in Microwave Modules

There are many complicated assemble kinds of RF PCB and RF part and RF component and Input/Output (I/O) in Microwave Modules, because of especial request to RF grounding soldering and cooling, traditional assemble mode by bolt fixing in Microwave Modules is not suffice high frequency circuit. In allusion to this need in work applications, the technique of multi-temperature Stepped Welding is expounded in this paper. It introduces the principle of selecting different temperature solder paste and preparative work ahead of Soldering in multi-temperature Gradient. It depicts process of multi-temperature Stepped Welding and demonstrates advantage of multi-temperature Stepped Welding. It proves that multi-temperature Stepped Welding is very efficacious way to ensure Microwave circuit capability by using different temperature solder paste.