DocumentCode :
119036
Title :
Design and fabrication of integrated waveguide filter based on high-resistivity silicon
Author :
Lin Du ; Shi Pu
Author_Institution :
Kay Lab. for Wide Band-gap Semicond. Mater. & Devices of Minist. of Educ., Xidian Univ., Xi´an, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1407
Lastpage :
1410
Abstract :
A tri-cavity Chebyshev bandpass filter based on high resistivity silicon is proposed and manufactured at Ku-band. MEMS etching process is utilized to etch via-holes array on high resistivity silicon. A fabricated tri-cavity Chebyshev bandpass filter after being packaged exhibits an insertion loss of 3.7 dB with a 6.8% relative bandwidth at a center frequency of 16 GHz and the return loss is better than 15 dB in the passband.
Keywords :
Chebyshev filters; band-pass filters; etching; microfabrication; silicon; substrate integrated waveguides; vias; waveguide filters; Ku-band; MEMS etching process; Si; frequency 16 GHz; high-resistivity silicon; insertion loss; integrated waveguide filter fabrication; tricavity Chebyshev bandpass filter; via-holes array; Band-pass filters; Conductivity; Electromagnetic waveguides; Microwave filters; Resonator filters; Silicon; Substrates; MEMS etching; high resistivity silicon; relative bandwidth; siw filter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922918
Filename :
6922918
Link To Document :
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