Title :
SmCo5-based thin films with high magnetic anisotropy for perpendicular magnetic recording
Author :
Sayama, Junichi ; Mizutani, Kazuki ; Yamashita, Yuki ; Asahi, Toru ; Osaka, Tetsuya
Author_Institution :
Graduate Sch. of Sci. & Eng., Waseda Univ., Tokyo, Japan
Abstract :
An investigation was carried out on the effects of the addition of Cu and the thickness of the SmCo5-based thin film with perpendicular magnetic anisotropy upon its magnetic properties, with the aim of reducing the Cu/Ti underlayer thickness. As a result, the Cu/Ti underlayer thickness necessary to obtain the squareness ratio of unity was successfully reduced from 125 to 50 nm. Moreover, for the SmCo5 double-layered perpendicular magnetic recording media with a CoZrNb soft magnetic underlayer, the Cu/Ti underlayer thickness was further reduced to 35 nm. However, the magnetic cluster size and the values of coercivity and saturation field of the SmCo5 media were found to be too large. Thus, we recognized the need for adjusting the cluster size and the magnetic properties to appropriate values, and also the need for investigating the possibility of using this material as patterned media or thermally assisted recording media.
Keywords :
cobalt alloys; coercive force; magnetic thin films; perpendicular magnetic anisotropy; perpendicular magnetic recording; samarium alloys; soft magnetic materials; CoZrNb; Cu-Ti; Cu/Ti under-layer thickness; SmCo5; SmCo5 thin film; magnetic cluster size; magnetic property; perpendicular magnetic anisotropy; perpendicular magnetic recording; saturation field; soft magnetic underlayer; thermally assisted recording media; Coercive force; Magnetic anisotropy; Magnetic films; Magnetic materials; Magnetic properties; Pattern recognition; Perpendicular magnetic anisotropy; Perpendicular magnetic recording; Saturation magnetization; Soft magnetic materials; Cu addition; Cu/Ti underlayer; SmCo; perpendicular magnetic anisotropy; perpendicular magnetic recording medium;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2005.854849