A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits

A critical stage in the manufacture of integrated circuit devices is inspection of the wire bonds which connect the chip to the lead fingers of the device. This paper describes a vision system for 1) automatic inspection of that part of the wire bond where the wire connects to the bond pad on the chip and 2) inspection of the 2-D profile of the bonding wire. A popular type of bonding (connection to bond pad) known as “ball bond” is considered here. Using two-dimensional images taken from the top of the IC wafer, the system determines several geometric measures which are important in determining the quality of the bond and the wire. These include the center and the boundary of the bond as well as the degree of straightness of the wire. A bond shape analysis based on the parameters of the best fitting ellipse to the bond is developed. The bonding process can be monitored through tracking the statistics of the bond shape measures. The system has been tested in a prototype manufacturing environment with excellent results