Title :
A New Architecture of a Two-Stage Lossless Data Compression and Decompression Algorithm
Author :
Lin, Ming-Bo ; Chang, Yung-Yi
Author_Institution :
Dept. of Electron. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
Abstract :
In this paper, we propose a new architecture for the two-level lossless data compression and decompression algorithm proposed in that combines the PDLZW algorithm and an approximated adaptive Huffman algorithm with dynamic-block exchange (AHDB). In the new architecture, we replace the CAM dictionary set used in the PDLZW algorithm with a CAM-tag-based dictionary set to reduce hardware cost and the CAM-based ordered list used in the AHDB algorithm with a memory inter-reference (MIR) stage realized by using two SRAMs. The resulting architecture is then implemented based on cell-based libraries with both 0.35-mum 2P4M and 0.18-mum 1P6M process technologies, respectively. With the same process technology, the prototyped chip demonstrates the new architecture not only has better performance, at least 33% improvement, but also occupies less area, only about 44%, and consumes less power, about 50%, in comparison with the architecture proposed in . In addition, the maximum data rate can achieve 2 Gbps when realizing in 0.35 mum 2P4M process technology and 4 Gbps when realizing in 0.18-mum 1P6M process technology.
Keywords :
content-addressable storage; data compression; memory architecture; random-access storage; AHDB algorithm; CAM-based ordered list; CAM-tag-based dictionary set; PDLZW algorithm; RAMs; approximated adaptive Huffman algorithm; bit rate 2 Gbit/s; bit rate 4 Gbit/s; cell-based libraries; content-addressable memory; dynamic-block exchange; memory inter-reference; size 0.18 mum; size 0.35 mum; two-level lossless data compression; two-level lossless data decompression; Adaptive Huffman algorithm; PDLZW algorithm; adaptive Huffman algorithm with dynamic-block exchange (AHDB); canonical Huffman coding; lossless data compression; lossy data compression; memory inter-reference (MIR);
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2008.2003512