Electrodeposited Co-Ni-Re-W-P thick array of high vertical magnetic anisotropy

Author

Ng, Wei Beng ; Takada, Akio ; Okada, Kanzo

Author_Institution

Singapore Res. Lab., Sony Electron. (Singapore) Pte Ltd, Singapore, Singapore

Volume

41

Issue

10

fYear

2005

Firstpage

3886

Lastpage

3888

Abstract

A magnetic material based on cobalt-nickel-rhenium-tungsten-phosphorus (Co-Ni-Re-W-P) composition has been developed by electrochemical deposition. With proper control of process conditions, hard magnetic films with high out-of-plane remanent magnetization (Mr) of 3.11 kG and coercivity (Hc) of 2.33 kOe are achieved. Fabrication of Co-Ni-Re-W-P in the form of microcylindrical arrays of ∼50 μm diameter and 90 μm height enhances the vertical anisotropy to a vertical Mr of 5.15 kG and Hc of 2.02 kOe. The materials and fabrication technique of microstructures as reported could be applied for the fabrication of magnetic microelectromechanical systems.

Keywords

cobalt alloys; coercive force; crystal microstructure; electrodeposition; magnetic anisotropy; magnetic devices; magnetic thin films; micromechanical devices; nickel alloys; phosphorus alloys; rhenium alloys; tungsten alloys; CoNiReWP; coercivity; electrochemical deposition; fabrication technique; hard magnetic films; magnetic anisotropy; magnetic material; magnetic microelectromechanical systems; microcylindrical arrays; microstructures; remanent magnetization; vertical anisotropy; Anisotropic magnetoresistance; Coercive force; Fabrication; Magnetic anisotropy; Magnetic films; Magnetic materials; Magnetization; Micromagnetics; Microstructure; Process control; Cobalt alloys; cylindrical arrays; electrochemical processes; magnetic films; perpendicular magnetic anisotropy;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2005.854942

Filename

1519477