Design of low dielectric glass+ceramics for multilayer ceramic substrate

Author

Jean, Jau-Ho ; Gupta, Tapan K.

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan

Volume

17

Issue

2

fYear

1994

fDate

5/1/1994 12:00:00 AM

Firstpage

228

Lastpage

233

Abstract

Compositional design and properties of a low dielectric constant glass+ceramics, containing borosilicate glass, high silica glass and alumina, for multilayer ceramic substrates are described. The new low dielectric system can be densified at below 1000°C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Compositions with tailor-made properties are designed according to a working model based upon mixing rule, and validated with experimental results. Compositions with a thermal expansion coefficient compatible with Si and GaAs, and a dielectric constant in the range of 4-4.5 and 5-6, respectively, are developed

Keywords

alumina; borosilicate glasses; ceramics; composite materials; integrated circuit technology; packaging; permittivity; substrates; thermal expansion; 1000 C; AgPd; Al₂O₃; Au; B₂O₃-SiO₂; BSG; MLC substrate; alumina; borosilicate glass; compositional modelling; glass/ceramics material composition; high electrical conductivity metallization; high silica glass; low dielectric constant; multilayer ceramic substrate; thermal expansion coefficient; Ceramics; Conductivity; Dielectric constant; Dielectric substrates; Glass; Gold; Metallization; Nonhomogeneous media; Silicon compounds; Thermal expansion;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.330424

Filename

330424