DocumentCode :
1194109
Title :
Delay macromodels for point-to-point MCM interconnections
Author :
Kayssi, Ayman I. ; Sakallah, Karem A.
Author_Institution :
Dept. of Electr. Eng., American Univ. of Beirut, Lebanon
Volume :
17
Issue :
2
fYear :
1994
fDate :
5/1/1994 12:00:00 AM
Firstpage :
147
Lastpage :
152
Abstract :
We develop delay macromodels for lossless as well as lossy point-to-point MCM transmission lines using a systematic model construction procedure that includes dimensional analysis. The result for lossless lines confirms earlier work and extends it to the case of nonlinear drivers and capacitive termination. For lossy lines, we show that dimensional analysis allows us to reduce the complexity of the delay expression without any loss in accuracy. A second-order polynomial fit to a four-argument delay function is shown to yield predictions that are within 5% of detailed circuit simulation at a fraction of the computational cost. We illustrate the applications of these macromodels in studying the effects of packaging technology on signal delay and in sensitivity analysis
Keywords :
delays; equivalent circuits; modelling; multichip modules; sensitivity analysis; transmission line theory; MCM transmission lines; capacitive termination; delay macromodels; dimensional analysis; four-argument delay function; lossless lines; lossy lines; model construction procedure; multichip modules; nonlinear drivers; packaging technology; point-to-point MCM interconnections; second-order polynomial fit; sensitivity analysis; signal delay; Circuit simulation; Computational efficiency; Delay effects; Driver circuits; Integrated circuit interconnections; Packaging; Polynomials; Propagation losses; Sensitivity analysis; Transmission lines;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.330436
Filename :
330436
Link To Document :
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