Title :
SPICE simulation of lossy and coupled interconnection lines
Author :
Dinh, T. Vu ; Cabon, B. ; Chilo, J.
Author_Institution :
Lab. of Electromag. & Optoelectron., Nat. Polytech. Inst., Grenoble, France
fDate :
5/1/1994 12:00:00 AM
Abstract :
A new simulation method for analyzing propagation characteristics of high frequency waves on single or coupled lossy interconnections is presented, based on the universal CAD SPICE software. The concept used is the direct analysis of lossy propagating lines as an equivalent circuit which can be easily modeled and simulated by SPICE software. The results obtained in both frequency and time domains agree well with other published methods. The applications to advanced packaging technology, especially for fast IC logic gates and superconductor materials, are promising and offer considerable potential
Keywords :
SPICE; circuit CAD; circuit analysis computing; coupled circuits; digital simulation; distributed parameter networks; equivalent circuits; frequency-domain analysis; multichip modules; skin effect; time-domain analysis; CAD SPICE software; SPICE simulation; advanced packaging technology; coupled interconnection lines; coupled lossy interconnections; equivalent circuit; fast IC logic gates; frequency domains; propagation characteristics; superconductor materials; time domains; Analytical models; Circuit simulation; Coupling circuits; Equivalent circuits; Frequency; Integrated circuit interconnections; Propagation losses; SPICE; Superconducting integrated circuits; Superconducting materials;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
