DocumentCode :
1194129
Title :
Adaptation of “SPICE3” to simulation of lossy multiple-coupled transmission lines
Author :
Lee, Dongjin ; Palusinski, Olgierd A.
Author_Institution :
CAD Center of Corp. Tech. Oper., Samsung Electron. Co. Ltd., Suwon City, South Korea
Volume :
17
Issue :
2
fYear :
1994
fDate :
5/1/1994 12:00:00 AM
Firstpage :
126
Lastpage :
133
Abstract :
Design of high-speed, high-performance electronic circuits requires simulation of transients in networks that include multiple, coupled lossy transmission lines. A widely used circuit simulator, SPICE, does not have facilities for simulation of multiconductor transmission lines. Recently a modification to SPICE3 to include multi-conductor lossless lines was reported. In many situations line losses must be included in the model and networks with lossy transmission simulated. In general simulation of lossy transmission lines is complex and computationally very intensive. The situation is simpler when D-C losses are considered. A recent study concluded that D-C losses provide an adequate modeling of signal transmission in many practical situations. This paper describes the implementation of multi-conductor, coupled lines with D-C losses in SPICE3e2. This implementation ties SPICE transient analysis with a special algorithm for the analysis of a transmission line and is more efficient than another approach based an the concept of a transmission line subcircuit. Internal tests of the new program, LSPICE3, were successfully performed and now this program is available to SPICE3 users
Keywords :
SPICE; VLSI; circuit analysis computing; coupled circuits; digital simulation; distributed parameter networks; DC losses; LSPICE3; circuit simulator; coupled interconnections; lossy multiple-coupled transmission lines; transient simulation; Circuit simulation; Computational modeling; Coupling circuits; Distributed parameter circuits; Electronic circuits; Multiconductor transmission lines; Power system transients; Propagation losses; SPICE; Transient analysis;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.330438
Filename :
330438
Link To Document :
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