DocumentCode
1194148
Title
Systems of multiple cluster tools: configuration, reliability, and performance
Author
López, Marcel J. ; Wood, Samuel C.
Author_Institution
Graduate Sch. of Int. Relations & Pacific Studies, California Univ., San Diego, La Jolla, CA, USA
Volume
16
Issue
2
fYear
2003
fDate
5/1/2003 12:00:00 AM
Firstpage
170
Lastpage
178
Abstract
The migration of semiconductor processes to single-wafer vacuum cluster tools has rendered configuration an important decision variable in fab operation and heightened the impact of reliability on fab performance. We address these closely linked issues by deriving the optimal configuration and operation of systems of cluster tools in the presence of scheduled maintenance. The two extremes in the spectrum of possible configurations are the serial configuration, in which the modules in a tool are all different, each representing a step in a process sequence, and the parallel configuration, in which each tool is assigned only one process step. We predict that the latter can offer higher throughputs. However, this advantage may be slight when equipment downtime is relatively schedulable and infrequent, in which the case the serial configuration may be preferable because of its superior cycle times. We also derive optimal lot sizing and release policies for systems of cluster tools. We conclude that fabs will gradually migrate from parallel configurations to serial as cluster tools become more reliable and cycle time becomes more important.
Keywords
cluster tools; maintenance engineering; reliability; cycle time; equipment downtime; fab operation; lot sizing; parallel configuration; release policy; reliability; scheduled maintenance; semiconductor manufacturing; serial configuration; single-wafer vacuum cluster tools; throughput; Job shop scheduling; Lot sizing; Maintenance; Manufacturing systems; Samarium; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor process modeling; Throughput; Virtual manufacturing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2003.810936
Filename
1198024
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