DocumentCode :
1194282
Title :
Direct measurement of field transistor threshold voltages using inversion layer fed transistors in deep submicron processes
Author :
Ellis, John N.
Volume :
16
Issue :
2
fYear :
2003
fDate :
5/1/2003 12:00:00 AM
Firstpage :
249
Lastpage :
252
Abstract :
Polysilicon field transistors are traditionally overlapped onto thin-oxide regions to connect to the source and drain of a transistor. Submicron processes have gate oxides with breakdown voltages below the field threshold and the traditional layout is not suitable. It is, however, necessary to maintain a channel to the source and drain, but this can be accomplished using a field plate device. By placing a metal gate over the poly gate, and biasing the metal gate into strong inversion, it is possible for the polysilicon gate to control the transistor current. In fact with this one structure both the polysilicon and metal-field threshold voltages can be ascertained.
Keywords :
CMOS integrated circuits; MOSFET; inversion layers; semiconductor device breakdown; semiconductor device measurement; voltage measurement; breakdown voltages; deep submicron CMOS processes; deep submicron processes; field plate device; gate oxides; inversion layer fed transistors; metal gate biasing; metal-field threshold voltages; polysilicon field transistors; strong inversion; thin-oxide regions; threshold voltage measurement; transistor current control; Area measurement; Circuit testing; EPROM; Electrodes; Electronic components; Joining processes; Logic devices; Logic gates; Power supplies; Threshold voltage;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2003.811572
Filename :
1198036
Link To Document :
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