• DocumentCode
    1194282
  • Title

    Direct measurement of field transistor threshold voltages using inversion layer fed transistors in deep submicron processes

  • Author

    Ellis, John N.

  • Volume
    16
  • Issue
    2
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    249
  • Lastpage
    252
  • Abstract
    Polysilicon field transistors are traditionally overlapped onto thin-oxide regions to connect to the source and drain of a transistor. Submicron processes have gate oxides with breakdown voltages below the field threshold and the traditional layout is not suitable. It is, however, necessary to maintain a channel to the source and drain, but this can be accomplished using a field plate device. By placing a metal gate over the poly gate, and biasing the metal gate into strong inversion, it is possible for the polysilicon gate to control the transistor current. In fact with this one structure both the polysilicon and metal-field threshold voltages can be ascertained.
  • Keywords
    CMOS integrated circuits; MOSFET; inversion layers; semiconductor device breakdown; semiconductor device measurement; voltage measurement; breakdown voltages; deep submicron CMOS processes; deep submicron processes; field plate device; gate oxides; inversion layer fed transistors; metal gate biasing; metal-field threshold voltages; polysilicon field transistors; strong inversion; thin-oxide regions; threshold voltage measurement; transistor current control; Area measurement; Circuit testing; EPROM; Electrodes; Electronic components; Joining processes; Logic devices; Logic gates; Power supplies; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2003.811572
  • Filename
    1198036