Title :
Monolithically integrated III-Sb CW super-luminal light emitting diodes on non-miscut Si (100) substrates
Author :
Balakrishnan, G. ; Mehta, M. ; Kutty, M.N. ; Patel, P. ; Albrecht, A.R. ; Rotella, P. ; Krishna, S. ; Dawson, L.R. ; Huffaker, D.L.
Author_Institution :
Center for High Technol. Mater., Univ. of New Mexico, Albuquerque, NM
Abstract :
Reported is super-luminescent emission under room-temperature, continuous-wave conditions from GaSb quantum-well-based light emitting diodes (LED), monolithically integrated on Si (100) substrates. The LEDs are realised with substrate growth temperature under 500degC for the entire process and the Si (001) substrate is non-miscut. The lattice mismatch at the AlSb/Si interface is accommodated by interfacial misfit dislocation arrays (IMF) resulting in low defect-density III-Sb material without thick metamorphic buffers. The devices are grown in etched trenches on the Si substrate to reduce anti-phase domains in the III-Sb. The n-Si substrate is contacted directly and thus current flows through the III-Sb/Si IMF interface. The diodes have extremely low leakage current density (Jleakage<0.2 A/cm2) in the reverse bias (-10 V) and show very good diode characteristics but exhibit a slightly elevated forward resistance (R~ 27 Omega), likely to be because of the IMF. The super-luminal spectra peaks at 2.14 mum with maximum output power ~0.125 mW
Keywords :
III-V semiconductors; aluminium compounds; dislocation arrays; elemental semiconductors; gallium compounds; integrated optoelectronics; leakage currents; quantum well devices; silicon; superluminescent diodes; AlSb-Si; GaSb-Si; Si; Si(100) substrates; antiphase domains; continuous-wave conditions; interfacial misfit dislocation arrays; lattice mismatch; leakage current density; low defect-density III-Sb material; metamorphic buffers; monolithically integrated CW super-luminal light emitting diodes; nonmiscut substrates; quantum-well-based light emitting diodes; substrate growth temperature; superluminescent emission;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20073333