Title :
A Comprehensive Shear-Testing Facility for Joint-Scale Solder Samples
Author :
Herkommer, Dominik ; Reid, Michael ; Punch, Jeff
Author_Institution :
Stokes Res. Inst., Univ. of Limerick, Limerick, Ireland
Abstract :
This paper describes the design and commissioning of a comprehensive shear testing apparatus for joint-scale solder samples. It allows for conducting most testing methods that are usually performed on solder specimens at highest precision for different temperatures. in situ observation of the solder joint can also be performed for micro structural studies. The various design features and the specimen manufacturing process are explained in detail. Creep test results on Sn96.5Ag3.0Cu0.5 (SAC305) and eutectic Sn63Pb37 (SP) solder are presented. Secondary creep rate, saturated primary creep strain and transition times between creep phases are investigated to demonstrate the capabilities of the shear-testing facility.
Keywords :
copper alloys; creep; creep testing; design engineering; eutectic alloys; lead alloys; shear deformation; silver alloys; solders; test equipment; tin alloys; SnAgCu; SnPb; comprehensive shear testing apparatus design; creep phase transition time; creep test; eutectic solder; joint-scale solder specimen; microstructural analysis; saturated primary creep strain; secondary creep rate; shear testing facility; solder joint; specimen manufacturing process; Joint-scale; SAC solder; shear test rig;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2009.2014071
