DocumentCode :
1196179
Title :
Effects of dynamic stressing on nitrided and reoxidized-nitrided chemical-vapor-deposited gate oxides
Author :
Hwang, Hyun-Sang ; Ting, Wenchi ; Kwong, Dim-Lee ; Lee, Jack ; Buhrow, Leonard ; Bowling, R. Allen
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
Volume :
10
Issue :
12
fYear :
1989
Firstpage :
568
Lastpage :
570
Abstract :
The degradation behaviour of thin (110 AA) nitrided and reoxidized-nitrided chemical-vapor-deposited (CVD) SiO/sub 2/ MOS gate dielectrics under dynamic voltage and current stressing is discussed. Results indicate that dynamic stressing increases charge-to-breakdown Q/sub bd/ and reduces charge trapping and midgap interface state generation within the dielectrics. These improvements, which can be explained by charge detrapping under dynamic stressing, depend on process conditions and the stress duty cycle.<>
Keywords :
chemical vapour deposition; dielectric thin films; insulated gate field effect transistors; semiconductor technology; semiconductor-insulator boundaries; 110 A; MOS gate dielectrics; SiO/sub x/N/sub y/ gate dielectrics; charge detrapping; charge-to-breakdown; charge-trapping reduction; degradation behaviour; dynamic stressing; improvements; midgap interface state generation; nitrided CVD oxides; process conditions; reoxidized nitrided CVD oxides; stress duty cycle; Chemical vapor deposition; Circuit testing; Degradation; Dielectric constant; Electron traps; Interface states; Life estimation; Life testing; Thermal stresses; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.43142
Filename :
43142
Link To Document :
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