DocumentCode
1196278
Title
Soldering on: the importance of surface-mount technology
Author
Grigson, A.
Volume
40
Issue
6
fYear
1994
fDate
11/17/1994 12:00:00 AM
Abstract
One of the main forces behind device miniaturisation has been surface mount technology (SMT). SMT uses miniaturised components soldered onto the top of printed circuit boards (PCBs) rather than the more traditional through-hole soldering techniques. The author discusses the two types of soldering used in SMT, reflow soldering and wave soldering, and describes the computer controlled production line. The production processes involved in SMT manufacture are described
Keywords
printed circuit manufacture; production control; reflow soldering; surface mount technology; wave soldering; SMT; SMT manufacture; computer controlled production line; device miniaturisation; printed circuit boards; production processes; reflow soldering; surface-mount technology; wave soldering;
fLanguage
English
Journal_Title
IEE Review
Publisher
iet
ISSN
0953-5683
Type
jour
DOI
10.1049/ir:19940615
Filename
333641
Link To Document