Title :
Foreword Special Section on Drop Testing
Abstract :
The six papers in this special section focus on drop testing. The papers are briefly summarized here.
Keywords :
Assembly; Cellular phones; Electronic equipment testing; Electronics packaging; Employee welfare; Industrial training; Semiconductor device modeling; Semiconductor device packaging; Thermal management; Wafer scale integration;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2007.893269
