• DocumentCode
    1197720
  • Title

    Crystallographic Texture and Whiskers in Electrodeposited Tin Films

  • Author

    Frye, Asa ; Galyon, George T. ; Palmer, Larry

  • Author_Institution
    Syst. & Technol. Div., IBM Corp., Poughkeepsie, NY
  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • Firstpage
    2
  • Lastpage
    10
  • Abstract
    Electron back scatter diffraction (EBSD) analysis was used to determine texture for electrodeposited tin films, and the results were compared to standard X-ray "times random" and full pole figure texture analysis. The data showed that EBSD and X-ray texture results differed as to primary and secondary texture determinations with some degree of correlation between texture determinations when primary/secondary/tertiary calculations were disregarded. It is these authors\´ opinion that film texture cannot be accurately determined using "times random" X-ray diffraction (XRD) techniques, and that there is considerable room for error with X-ray pole figure analyses. These data must be considered preliminary due to the small sample size, but these results indicate that electroplaters may have better control over as-deposited tin film texture than is currently believed, and that there is a relationship between as-deposited texture and film stress
  • Keywords
    electrodeposits; electron backscattering; electron diffraction crystallography; texture; tin; whiskers (crystal); Sn; crystallographic texture; electrodeposited tin films; electron back scatter diffraction analysis; pole figures; whiskers; Backscatter; Crystallography; Grain boundaries; Stress control; Substrates; Surface morphology; Testing; Tin; X-ray diffraction; X-ray scattering; Electron backscatter diffraction; pole figures; texture; tin films;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2007.891763
  • Filename
    4118348