Title :
Crystallographic Texture and Whiskers in Electrodeposited Tin Films
Author :
Frye, Asa ; Galyon, George T. ; Palmer, Larry
Author_Institution :
Syst. & Technol. Div., IBM Corp., Poughkeepsie, NY
Abstract :
Electron back scatter diffraction (EBSD) analysis was used to determine texture for electrodeposited tin films, and the results were compared to standard X-ray "times random" and full pole figure texture analysis. The data showed that EBSD and X-ray texture results differed as to primary and secondary texture determinations with some degree of correlation between texture determinations when primary/secondary/tertiary calculations were disregarded. It is these authors\´ opinion that film texture cannot be accurately determined using "times random" X-ray diffraction (XRD) techniques, and that there is considerable room for error with X-ray pole figure analyses. These data must be considered preliminary due to the small sample size, but these results indicate that electroplaters may have better control over as-deposited tin film texture than is currently believed, and that there is a relationship between as-deposited texture and film stress
Keywords :
electrodeposits; electron backscattering; electron diffraction crystallography; texture; tin; whiskers (crystal); Sn; crystallographic texture; electrodeposited tin films; electron back scatter diffraction analysis; pole figures; whiskers; Backscatter; Crystallography; Grain boundaries; Stress control; Substrates; Surface morphology; Testing; Tin; X-ray diffraction; X-ray scattering; Electron backscatter diffraction; pole figures; texture; tin films;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2007.891763