Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

Author

Tsai, Tsung-Yueh ; Yeh, Chang-Lin ; Lai, Yi-Shao ; Chen, Rong-Sheng

Author_Institution

Adv. Semicond. Eng., Inc, Kaohsiung

Volume

30

Issue

1

fYear

2007

Firstpage

54

Lastpage

62

Abstract

We present in this paper a submodeling analysis procedure capable of solving transient mechanical responses of board-level electronic packages subjected to drop impact loads, involving large deformations and nonlinear elastoplastic constitutive relationships for the solder alloy. This paper is focused on the verification of this submodeling analysis procedure and to investigate solution deviations caused by several abbreviated global models that involve simplified geometry or material properties for the solder joints

Keywords

electronics packaging; reliability; transient analysis; board-level drop test; drop impact loads; electronic packages; transient submodeling analysis; Chip scale packaging; Councils; Electron devices; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Finite element methods; Laboratories; Soldering; Transient analysis; Board-level drop test; Joint Electron Device Engineering Council (JEDEC); elastoplastic; reliability; submodeling; transient analysis;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2006.890639

Filename

4118374