Abstract :
An overview is given of stress-free potting. The coefficient of thermal expansion (CTE) and melting point of component materials are related because of the strong correlation between the two properties. Equations given are tools that can be used by the formulator to help bring the formulated product to the desired CTE and melting point. Shrinkage, a direct result of covalent bonding during cure, is discussed. Shrinkage can be retarded with a slower or lower temperature cure but is minimized by the addition of nonshrink, nonreactive materials to take up the available volume.<>
Keywords :
filled polymers; organic insulating materials; packaging; thermal expansion; coefficient of thermal expansion; covalent bonding during cure; curing; melting point; nonreactive materials; nonshrink materials; overview; stress-free potting; Costs; Equations; Phase change materials; Polymers; Temperature dependence; Temperature distribution; Temperature measurement; Thermal expansion; Thermal stresses; Viscosity;
