Thick and stress-free Sendust films on silicon for recording head cores

Author

Daval, J. ; Béchevet, B. ; Arroyo, J. ; Valon, B. ; Armand, M.F. ; Joisten, H.

Author_Institution

LETI, Grenoble, France

Volume

30

Issue

6

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

3930

Lastpage

3932

Abstract

LETI´s recording heads technology requires the deposition of thick Sendust films on silicon substrates, both materials having very different thermal expansion coefficients. Despite of this unfavorable condition, adherent and stress-controlled films, up to 10 μm thick, have first been obtained by facing target sputtering under Ar+ nitrogen atmosphere whose influence is great on films´ microstructure. Stress-free state has then been achieved by cumulative rapid thermal annealing when starting from compressive stress-induced films

Keywords

aluminium alloys; ferromagnetic materials; internal stresses; iron alloys; magnetic cores; magnetic heads; magnetic thin film devices; rapid thermal annealing; silicon alloys; soft magnetic materials; sputtered coatings; 10 micron; Ar+ nitrogen atmosphere; FeSiAl; LETI; Sendust films; Si; adherent films; compressive stress; facing target sputtering; microstructure; rapid thermal annealing; recording head cores; silicon substrates; stress-free films; thermal expansion coefficients; thick films; Atmosphere; Magnetic heads; Microstructure; Nitrogen; Rapid thermal annealing; Semiconductor films; Silicon; Sputtering; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.333947

Filename

333947