DocumentCode :
1200026
Title :
Prismatic Coupling Structure for Intrachip Global Communication
Author :
Gu, Tian ; Nair, Rohit ; Haney, Michael W.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE
Volume :
45
Issue :
4
fYear :
2009
fDate :
4/1/2009 12:00:00 AM
Firstpage :
388
Lastpage :
395
Abstract :
Metal wires for global communication on integrated circuits have become problematic as device integration densities scale with rapid advancements in CMOS technology. They may not be able to deliver the growing bandwidth requirements of future microprocessors. Optical interconnect technologies may provide a solution to meet this challenge and extend Moore´s law. In this paper, a novel guided-wave optical interconnect fabric aiming to replace the slow global metal interconnections is proposed and analyzed. The reflection-mode multiple-quantum-well-modulator-based optical interconnection approach is projected to achieve high coupling efficiency and be compatible with standard CMOS processes. The key notion is a prismatic coupling structure that is embedded in the optical waveguide and therefore has a very small footprint in the circuit. Ray-trace and finite-difference time-domain simulation results predict high coupling efficiency of this structure.
Keywords :
CMOS integrated circuits; integrated optoelectronics; optical interconnections; optical waveguides; CMOS technology; Ray-trace; guided wave optical interconnect fabric; intrachip global communication; metal wires; optical interconnect technologies; optical waveguide; prismatic coupling structure; reflection mode multiple quantum well modulator; Bandwidth; CMOS integrated circuits; CMOS technology; Coupling circuits; Global communication; Integrated circuit technology; Optical coupling; Optical interconnections; Optical waveguides; Wires; Global interconnects; multiple quantum-well modulator (MQWM); optical design; optical interconnections;
fLanguage :
English
Journal_Title :
Quantum Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9197
Type :
jour
DOI :
10.1109/JQE.2009.2013213
Filename :
4803865
Link To Document :
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