DocumentCode :
1200093
Title :
Electrical modeling of integrated-package power and ground distributions
Author :
Zheng, Hui ; Pileggi, Lawrence ; Kratiter, B.
Author_Institution :
Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume :
20
Issue :
3
fYear :
2003
Firstpage :
24
Lastpage :
31
Abstract :
Ensuring reliable power distribution requires accurate modeling of on-package power and ground networks. This, in turn, necessitates efficient magnetic coupling modeling - a massively complex task. Extending their previous work, these authors introduce a window-based extraction technique that uses the physical concept of susceptance to control modeling complexity.
Keywords :
CMOS integrated circuits; VLSI; integrated circuit design; integrated circuit modelling; optimisation; reduced order systems; 3D magnetic couplings; CMOS; VLSI; ground distributions; macromodeling; model order reduction; on-package decoupling capacitor optimization; on-package power distributions; susceptance-based simulation; Circuit simulation; Coupling circuits; Inductance; Integrated circuit interconnections; Magnetic susceptibility; Packaging; Power distribution; Power system interconnection; Power system modeling; Sparse matrices;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/MDT.2003.1198682
Filename :
1198682
Link To Document :
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