Title :
Quality analysis of superconducting wire and cable for SSC dipole magnets: a comparison of recent performance and specification requirements
Author :
Pollock, Douglas A.
Author_Institution :
Superconducting Super Collider Lab., Dallas, TX, USA
fDate :
1/1/1992 12:00:00 AM
Abstract :
A critical component of the SSC (Superconducting Super Collider) dipole magnets is superconducting cable. The uniformity and reliability requirements for the dipoles place stringent demands on the cable. These needs have been defined as various contract requirements in the material specifications for NbTi alloy, superconducting wire, and cable. A supplier qualification program is being started by the SSC Laboratory (SSCL) with industry to establish reliable sources of superconductor cable. To monitor conductor performance, a computer database is being developed. The database focuses on the understanding and control of variation in the manufacture of wire and cable. A statistical and graphical summary of current data for key performance variables is presented in light of the specification requirement for uniformity. Superconductor material characteristics addressed include wire critical current, copper-to-non-copper ratio, wire diameter, wire piece-length, and cable dimensional control
Keywords :
beam handling equipment; critical currents; niobium alloys; proton accelerators; reliability; storage rings; superconducting cables; superconducting magnets; synchrotrons; titanium alloys; Cu; NbTi alloy; NbTi-Cu; SSC dipole magnets; Superconducting Super Collider; cable dimensional control; computer database; critical current; qualification program; quality analysis; reliability requirements; specification requirements; superconducting cable; superconducting wire; wire diameter; wire piece-length; Conducting materials; Contracts; Databases; Magnetic analysis; Magnetic materials; Niobium compounds; Superconducting cables; Superconducting filaments and wires; Superconducting magnets; Superconducting materials;
Journal_Title :
Magnetics, IEEE Transactions on