Title :
High-performance 0.1-μm In/sub 0.4/AlAs/In/sub 0.35/GaAs MHEMTs with Ar plasma treatment
Author :
Sung-Won Kim ; Kang-Min Lee ; Jae-Hak Lee ; Kwang-Seok Seo
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., South Korea
Abstract :
High-performance 0.1-μm In/sub 0.4/AlAs/In/sub 0.35/GaAs metamorphic high-electron mobility transistors (MHEMTs) on GaAs substrate have been successfully fabricated with Ar plasma treatment. Before the gate Schottky metallization, the devices were treated with Ar plasma, which might clean and improve the surface of exposed barrier layer. The devices fabricated with Ar plasma treatment exhibited the excellent characteristics such as 50% reduction of the reverse gate leakage currents, the improved Schottky ideality factor of 1.37, high extrinsic transconductance of 700 mS/mm, and high maximum drain current density of 780 mA/mm. And the cutoff frequency fT as high as 210 GHz was achieved. To our knowledge, this is the best reported cutoff frequency for a 0.1-μm MHEMT with an indium content of 35% in the channel.
Keywords :
III-V semiconductors; aluminium compounds; gallium arsenide; high electron mobility transistors; indium compounds; millimetre wave field effect transistors; plasma materials processing; semiconductor device metallisation; 0.1 micron; 210 GHz; Ar plasma treatment; GaAs substrate; HEMT; In/sub 0.4/AlAs-In/sub 0.35/GaAs-GaAs; MHEMT; Schottky ideality factor; barrier layer; cutoff frequency; gate Schottky metallization; high extrinsic transconductance; high maximum drain current density; metamorphic high-electron mobility transistors; reverse gate leakage currents; Argon; Cutoff frequency; Gallium arsenide; HEMTs; MODFETs; Metallization; Plasma devices; Plasma properties; Surface cleaning; mHEMTs; Ar plasma; high-electron mobility transistor (HEMT); metamorphic; transconductance;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2005.857723