Title :
Implementation of perfect-magnetic-coupling ultralow-loss transformer in RFCMOS technology
Author_Institution :
Dept. of Electr. Eng., Nat. Chi-Nan Univ., Puli, Taiwan
Abstract :
In this letter, we propose a single-turn multiple-layer interlaced stacked transformer structure with nearly perfect magnetic-coupling factor (kIM∼1) using standard mixed-signal/RF CMOS (or BiCMOS) technology. A single-turn six-layer interlaced stacked transformer was implemented to demonstrate the proposed structure. Temperature dependence (from -25°C to 175°C) of the quality-factor (Q-factor), kIm, resistive-coupling factor (kRe), maximum available power gain (GAmax), and minimum noise figure (NFmin) performances of the transformer are reported. State-of-the-art GAmax of 0.762 and 0.904 (i.e., NFmin of 1.181 dB and 0.437 dB) have been achieved at 5.2 and 8 GHz, respectively, at room temperature, mainly due to the perfect magnetic-coupling factor and the high resistive-coupling factor. The present analysis is helpful for RF engineers to design ultralow-voltage high-performance transformer-feedback low-noise amplifiers and voltage-controlled oscillators, and other radio frequency integrated circuits which include transformers.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; Q-factor; high-frequency transformers; radiofrequency integrated circuits; silicon; system-on-chip; 1.81 dB; 5.2 GHz; 8 GHz; BiCMOS technology; Q-factor; RFCMOS technology; SOC; low-noise amplifiers; magnetic-coupling; mixed-signal/RF CMOS technology; quality factor; radio frequency integrated circuits; resistive-coupling factor; single-turn six-layer interlaced stacked transformer; system-on-chip; temperature dependence; ultralow-loss transformer; voltage-controlled oscillators; BiCMOS integrated circuits; CMOS technology; Design engineering; Magnetic analysis; Noise figure; Noise measurement; Performance gain; Q factor; Radio frequency; Temperature dependence; Interlaced; magnetic coupling; silicon substrate; stacked; system-on-chip (SOC); transformer;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2005.857720