DocumentCode :
1203314
Title :
Reliability Impact of Chalcogenide-Structure Relaxation in Phase-Change Memory (PCM) Cells—Part I: Experimental Study
Author :
Ielmini, Daniele ; Sharma, Deepak ; Lavizzari, Simone ; Lacaita, Andrea L.
Author_Institution :
Dipt. di Elettron. e Inf., Politec. di Milano, Milan
Volume :
56
Issue :
5
fYear :
2009
fDate :
5/1/2009 12:00:00 AM
Firstpage :
1070
Lastpage :
1077
Abstract :
The phase-change memory (PCM) relies on the electrical properties of the chalcogenide materials to represent the stored bit of information. As a result, data stability depends on structural relaxation (SR) in the amorphous chalcogenide phase, which results in a temperature-accelerated time evolution of the electrical properties of the active material. Here, we address the time, temperature, and bias dependence of SR effects on the amorphous Ge2Sb2Te5 (GST) material used in PCM cells. Electrical measurements for increasing annealing time and temperature indicate that SR can be described by a defect annihilation process in the amorphous chalcogenide material. Finally, the stability of chalcogenide resistance as a function of the read conditions is discussed, for the purpose of reducing the impact of SR on the reliability of PCM devices.
Keywords :
chalcogenide glasses; phase change memories; active material; amorphous chalcogenide phase; annihilation process; chalcogenide-structure relaxation; electrical properties; phase-change memory cells; Amorphous materials; Electric variables measurement; Electrical resistance measurement; Phase change materials; Phase change memory; Stability; Strontium; Tellurium; Temperature dependence; Time measurement; Amorphous semiconductors; chalcogenide materials; nonvolatile memory; phase-change memory (PCM); reliability estimation; reliability modeling;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2016397
Filename :
4804709
Link To Document :
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