DocumentCode :
1204095
Title :
Reduction of current collapse in AlGaN/GaN HFETs using AlN interfacial layer
Author :
Lee, J.S. ; Kim, J.W. ; Lee, J.H. ; Kim, C.S. ; Oh, J.E. ; Shin, M.W. ; Lee, J.H.
Author_Institution :
Adv. Devices Group, LG Electron. Inst. of Technol., Seoul, South Korea
Volume :
39
Issue :
9
fYear :
2003
fDate :
5/1/2003 12:00:00 AM
Firstpage :
750
Lastpage :
752
Abstract :
Modified AlGaN/AlN/GaN HFET structures were grown and the current collapse phenomena were examined. Pulsed I-V measurements showed that the insertion of the thin AlN interfacial layer was effective in preventing the electrons in the 2DEG channel from being transferred to the surface and bulk traps in the AlGaN barrier layer.
Keywords :
III-V semiconductors; aluminium compounds; electron traps; gallium compounds; microwave field effect transistors; microwave measurement; microwave power transistors; power field effect transistors; semiconductor device measurement; two-dimensional electron gas; wide band gap semiconductors; 2DEG channel; AlGaN-AlN-GaN; AlGaN/AlN/GaN; HFETs; barrier layer; bulk traps; current collapse; high-power microwave electronics; interfacial layer; pulsed I-V measurements; surface traps;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20030473
Filename :
1199985
Link To Document :
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