Development of an alternative wire bond test technique

Author

Pecht, Michael ; Barker, Donald ; Lall, Pradeep

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

Volume

17

Issue

4

fYear

1994

fDate

12/1/1994 12:00:00 AM

Firstpage

610

Lastpage

615

Abstract

An alternative test technique to the wire bond pull test is presented for wire bond interconnects. The new test technique, based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method. The new technique greatly reduces the test time in comparison with the existing MIL-STD-883 pull test and internal visual inspection. This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects that would otherwise escape visual inspection

Keywords

integrated circuit interconnections; integrated circuit testing; lead bonding; life testing; quality control; defects; electromagnetic resonance; on-line use; operational life evaluation; operational stress; quality assurance; simulation; test technique; wire bond interconnects; Bonding forces; Inspection; Life testing; Modems; Nondestructive testing; Quality assurance; Resonance; Stress; Ultra large scale integration; Wire;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.335048

Filename

335048