• DocumentCode
    1204202
  • Title

    A practical excimer laser-based cleaning tool for removal of surface contaminants

  • Author

    Park, Hee K. ; Grigoropoulos, Costas P. ; Leung, Wing P. ; Tam, Andrew C.

  • Author_Institution
    Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
  • Volume
    17
  • Issue
    4
  • fYear
    1994
  • fDate
    12/1/1994 12:00:00 AM
  • Firstpage
    631
  • Lastpage
    643
  • Abstract
    A laser-cleaning tool capable of removing surface contaminants such as submicron-sized particulates and organic films has been constructed and implemented in practical use. An industrial-grade KrF excimer laser is utilized to irradiate the solid surface to be cleaned. The nanosecond-pulsed laser irradiation, shortly after the deposition of a thin liquid film on the surface, induces explosive vaporization of the liquid and removal of particulates (“steam cleaning”). The ultraviolet (UV) irradiation also causes ablative photodecomposition of organic film contaminants on the surface (“dry cleaning”). Hence, cleaning can best be done with the combination of these two laser-cleaning modes. The excimer laser cleaning tool is constructed with an aim toward practical use: It includes a computer-controlled laser beam scanning system and a stable liquid film deposition unit, providing a cleaning rate of over 200 cm /min. Semiconductor, metal, and ceramic sample surfaces, contaminated with 1-μm sized alumina particles and micron-thick epoxy films, are tested by laser cleaning. The effectiveness of laser cleaning is compared with ultrasonic technique. The cleaning strategy and the probability of thermal damage due to laser cleaning are discussed
  • Keywords
    excimer lasers; laser materials processing; surface cleaning; surface contamination; 1 micron; KrF; ablative photodecomposition; alumina particles; ceramic; computer-controlled laser beam scanning system; dry cleaning; epoxy films; explosive vaporization; industrial-grade KrF excimer laser; laser-cleaning tool; liquid film deposition; metal; nanosecond-pulsed laser irradiation; organic films; semiconductor; steam cleaning; submicron-sized particulates; surface contaminants; thermal damage; ultraviolet irradiation; Cleaning; Explosives; Laser beams; Laser modes; Laser stability; Semiconductor films; Semiconductor lasers; Solid lasers; Surface contamination; Surface emitting lasers;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.335050
  • Filename
    335050