Applications of polyimide films to the electrical and electronic industries in Japan

Author

Sugimoto, Eiichi

Author_Institution

Nitto Denko Corp., Tokyo, Japan

Volume

5

Issue

1

fYear

1989

Firstpage

15

Lastpage

23

Abstract

The development of polyimide films in Japan is discussed. The chemical structure of the films and their polymerization mechanisms are described. Types of polyimide films are identified, and their characteristics are examined. Special attention is given to their thermal and chemical properties and their radiation resistance. Applications of polyimide films to rotating machines, integrated circuits, tape-automated bonding, flexible printed-circuit boards, electric wires, aerospace and nuclear equipment, and recording devices are discussed.<>

Keywords

organic insulating materials; polymer films; Japan; aerospace; chemical properties; chemical structure; electric wires; flexible printed-circuit boards; integrated circuits; nuclear equipment; organic insulating material; polyimide films; polymerization mechanisms; radiation resistance; recording devices; rotating machines; tape-automated bonding; thermal properties; Application specific integrated circuits; Bonding; Chemicals; Electric resistance; Electronics industry; Polyimides; Polymer films; Rotating machines; Thermal resistance; Wires;

fLanguage

English

Journal_Title

Electrical Insulation Magazine, IEEE

Publisher

ieee

ISSN

0883-7554

Type

jour

DOI

10.1109/57.16949

Filename

16949