DocumentCode :
1205427
Title :
Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process
Author :
Choon-Gi Choi ; Sang-Pil Han ; Byeong Cheol Kim ; Seung-Ho Ahn ; Myung-Yung Jeong
Author_Institution :
Opt. Interconnection Team, Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Volume :
15
Issue :
6
fYear :
2003
fDate :
6/1/2003 12:00:00 AM
Firstpage :
825
Lastpage :
827
Abstract :
Large-core (42 ×43 μm) 1×16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the arc-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
Keywords :
curing; moulding; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; 42 micron; 43 micron; 850 nm; Y-branch waveguide structures; arc-bending regions; average insertion losses; beam propagation method software; epoxy core filling; hot-embossing process; large-core 1 by 16 optical power splitters; maximum uniformities; offsets; optical power splitters; polymers; silicon-mold master; ultraviolet curing processes; Curing; Filling; Insertion loss; Loss measurement; Optical device fabrication; Optical losses; Optical polymers; Optical propagation; Optical waveguides; Wavelength measurement;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2003.811139
Filename :
1200212
Link To Document :
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