• DocumentCode
    1205427
  • Title

    Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process

  • Author

    Choon-Gi Choi ; Sang-Pil Han ; Byeong Cheol Kim ; Seung-Ho Ahn ; Myung-Yung Jeong

  • Author_Institution
    Opt. Interconnection Team, Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • Volume
    15
  • Issue
    6
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    825
  • Lastpage
    827
  • Abstract
    Large-core (42 ×43 μm) 1×16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the arc-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
  • Keywords
    curing; moulding; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; 42 micron; 43 micron; 850 nm; Y-branch waveguide structures; arc-bending regions; average insertion losses; beam propagation method software; epoxy core filling; hot-embossing process; large-core 1 by 16 optical power splitters; maximum uniformities; offsets; optical power splitters; polymers; silicon-mold master; ultraviolet curing processes; Curing; Filling; Insertion loss; Loss measurement; Optical device fabrication; Optical losses; Optical polymers; Optical propagation; Optical waveguides; Wavelength measurement;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2003.811139
  • Filename
    1200212