DocumentCode
1205427
Title
Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process
Author
Choon-Gi Choi ; Sang-Pil Han ; Byeong Cheol Kim ; Seung-Ho Ahn ; Myung-Yung Jeong
Author_Institution
Opt. Interconnection Team, Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Volume
15
Issue
6
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
825
Lastpage
827
Abstract
Large-core (42 ×43 μm) 1×16 optical power splitters in polymers have been fabricated. Y-branch waveguide structures with and without offsets in the arc-bending regions were designed by the beam propagation method software and molded by a silicon-mold master using a hot-embossing process. The optical power splitters were produced by epoxy core filling and ultraviolet curing processes. The average insertion losses at a wavelength of 850 nm were measured to be 19.8 dB with offset and 17.1 dB without offset, respectively. The maximum uniformities were 3.3 dB with offset and 3.9 dB without offset, respectively.
Keywords
curing; moulding; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; 42 micron; 43 micron; 850 nm; Y-branch waveguide structures; arc-bending regions; average insertion losses; beam propagation method software; epoxy core filling; hot-embossing process; large-core 1 by 16 optical power splitters; maximum uniformities; offsets; optical power splitters; polymers; silicon-mold master; ultraviolet curing processes; Curing; Filling; Insertion loss; Loss measurement; Optical device fabrication; Optical losses; Optical polymers; Optical propagation; Optical waveguides; Wavelength measurement;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2003.811139
Filename
1200212
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