DocumentCode :
1205618
Title :
Investigation and Modeling of Hot Carrier Effects on Performance of 45- and 55-nm NMOSFETs With RF Automatic Measurement
Author :
Tang, Mao-Chyuan ; Fang, Yean-Kuen ; Liao, Wen-Shiang ; Chen, David C. ; Yeh, Chune-Sin ; Chien, Shan-Chieh
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan
Volume :
55
Issue :
6
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
1541
Lastpage :
1546
Abstract :
Effects of hot carriers on dc and RF reliabilities for both 45- and 55-nm negative metal-oxide-semiconductor field-effect transistors with in-line ground-signal-signal-ground test-pad structures were investigated in detail. The investigations were evaluated by an RF automatic testing system with a proprietary control program in Agilent´s Integrated Circuit Characterization and Analysis Program software. After a hot carrier stress, we found that the increase in Cgs is larger than the decrease in Cgd for 55- and 45-nm devices, and the difference increases as the process technology keeps advancing. Thus, the degradations of cutoff frequency fT and maximum oscillation frequency fmax are dependent on transconductance gm and gate capacitance Cgg (= Cgs + Cgd) for 45- and 55-nm devices. This is different than many conventional studies that used low-frequency equipment. We propose a surface channel resistance model to comprehensively interpret the observations and verify it by the slope changes in the curves of measured fT versus gm.
Keywords :
MOSFET; hot carriers; integrated circuit reliability; integrated circuit testing; nanoelectronics; NMOSFET; RF automatic measurement; RF automatic testing system; RF reliabilities; analysis program software; hot carrier effects; in-line ground-signal-signal-ground test-pad structures; integrated circuit characterization; negative metal-oxide-semiconductor field-effect transistors; oscillation frequency; size 45 nm; size 55 nm; surface channel resistance model; Circuit testing; Cutoff frequency; FETs; Hot carrier effects; Hot carriers; Integrated circuit measurements; Integrated circuit reliability; MOSFETs; Radio frequency; Surface resistance; Cutoff frequency; hot carrier effect (HCE); in-line ground–signal–signal–ground (GSSG) test-pad structure; in-line ground–signal–signal–ground (GSSG) test-pad structure; surface channel resistance model; transconductance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2008.921998
Filename :
4505241
Link To Document :
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