• DocumentCode
    1207450
  • Title

    Coupling studies and shielding techniques for electromagnetic penetration through apertures on complex cavities and vehicular platforms

  • Author

    Siah, Eng Swee ; Sertel, Kubilay ; Volakis, John L. ; Liepa, Valdis V. ; Wiese, Rich

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    45
  • Issue
    2
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    245
  • Lastpage
    257
  • Abstract
    The multilevel fast multipole moment method is employed to compute the electromagnetic coupling and shielding of various aperture-coupled metallic enclosures. A phenomenological study of electromagnetic coupling, due to various slot shapes and sizes, with or without the presence of wire penetration is conducted. These slots are situated on over-moded cavities and two methods are proposed to mitigate slot coupling into the cavity´s interior. As part of this work, we also investigate the coupling through similar slots and apertures within a complex platform such as an automobile. The proposed methods have shown to increase shielding by as much as 5-35 dB within the frequency range of interest.
  • Keywords
    automobiles; cavity resonators; electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; electromagnetic shielding; method of moments; packaging; aperture-coupled metallic enclosures; apertures; automobile; complex cavities; coupling studies; electromagnetic coupling; electromagnetic interference; electromagnetic penetration; multilevel fast multipole moment method; numerical modeling; phenomenological study; shielding techniques; slot coupling mitigation; slot shapes; vehicular platforms; wire penetration; Apertures; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic shielding; Finite difference methods; Frequency; Laboratories; Moment methods; Time domain analysis; Wire;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2003.810814
  • Filename
    1200872