Title :
Polarity asymmetry of oxides grown on polycrystalline silicon
Author :
Lee, Jack C. ; Hu, Chenming
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fDate :
7/1/1988 12:00:00 AM
Abstract :
The quality of oxide thermally grown on polycrystalline silicon, commonly referred to as polyoxide, is strongly dependent on polysilicon doping processes and polyoxide growth conditions. The electrical properties of polyoxides using different polysilicon doping processes (in situ, ion implanted, and POCl3) and different oxidation processes (dry, wet, and LPCVD) have been studied. The emphasis is on the dependence of the polarity asymmetry of leakage current, critical electric field histogram, electron trapping rate, and charge to breakdown. Polyoxides with in situ doped polysilicon exhibit an unusual polarity asymmetry, i.e. higher field enhancement and charge to breakdown are observed when the upper electrode is biased negative. This is the opposite of the asymmetry reported for polyoxides before. High-temperature annealing of the polysilicon films prior to oxidation reduces this asymmetry
Keywords :
annealing; electric breakdown of solids; electron traps; electronic conduction in insulating thin films; elemental semiconductors; integrated circuit technology; leakage currents; oxidation; semiconductor doping; semiconductor-insulator boundaries; silicon; LPCVD; MOS IC technology; POCl3; Si-SiO2; charge to breakdown; critical electric field histogram; dry process; electrical properties; electron trapping rate; field enhancement; high temperature annealing; in situ doped polysilicon; ion implantation; leakage current; negatively biased upper electrode; oxidation processes; polarity asymmetry; poly-Si doping processes; polycrystalline Si; polyoxide growth conditions; wet process; Annealing; Dielectric breakdown; Doping; Electric breakdown; Electrodes; Electron traps; Histograms; Leakage current; Oxidation; Silicon;
Journal_Title :
Electron Devices, IEEE Transactions on