Title :
Applications ´90: industrial electronics
Author_Institution :
IEEE Spectrum, New York, NY, USA
Abstract :
Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed-circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated power functions in power electronics systems.<>
Keywords :
electric sensing devices; manufacturing data processing; printed circuit testing; robots; AD 1989; X-ray scanning-beam laminography; industrial electronics; manufactured part acquisition computer facility; modular integrated power functions; power electronics systems; pressure microsensors; printed-circuit boards; service industry robots; solder joint checking; Application software; Computer aided manufacturing; Computer industry; Electronics industry; Industrial electronics; Manufacturing industries; Microsensors; Resonance; Resonant frequency; Soldering;
Journal_Title :
Spectrum, IEEE
