• DocumentCode
    1208474
  • Title

    FEA-Aided Design for a Working Model of a Split Florida-Helix

  • Author

    Toth, Jack ; Bird, Mark D.

  • Author_Institution
    Nat. High Magn. Field Lab., Tallahassee, FL
  • Volume
    18
  • Issue
    2
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    575
  • Lastpage
    578
  • Abstract
    The NHMFL is developing a high-field split resistive magnet for use in far-infrared photon scattering experiments. The magnet will include four large scattering ports of elliptical shape at the midplane. Such a magnet configuration results in unique design challenges being especially severe for the windings in the midplane region of the innermost coils. Consequently, the NHMFL developed a new technology called split Florida-helix. To test and demonstrate those new concepts, the NHMFL recently completed the design and fabrication of a working model of a split Florida- helix. Advanced 3-D finite element analysis (FEA) served as the essential tool guiding the design optimization. This paper provides a systematic discussion of the critical features and techniques utilized in the complex model-based analysis including orthotropic material properties, actual non-symmetric current and load distributions as well as turn-to-turn frictional contact and sliding. Furthermore, the authors present a variety of detailed FEA results that prove to be fundamental for a successful application and integration of the split Florida-helix. Critical design decisions are discussed.
  • Keywords
    current distribution; finite element analysis; friction; superconducting magnets; 3-D finite element analysis; complex model-based analysis; high-field split resistive magnet; load distribution; nonsymmetric current distribution; orthotropic material properties; sliding; split Florida-helix; turn-to-turn frictional contact; Finite element analysis; high field solenoids; model-based analysis; resistive magnets;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2008.921942
  • Filename
    4509465