DocumentCode :
1208762
Title :
Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors
Author :
Van Campenhout, Joris ; Binetti, Pietro R A ; Romeo, Pedro Rojo ; Regreny, Philippe ; Seassal, Christian ; Leijtens, Xaveer J M ; de Vries, Tjibbe ; Oei, Yoki Siang ; Van Veldhoven, Rene P J ; Nötzel, Richard ; Cioccio, Léa Di ; Fedeli, Jean-Marc ; Smit,
Author_Institution :
IMEC, Ghent Univ., Ghent
Volume :
21
Issue :
8
fYear :
2009
fDate :
4/15/2009 12:00:00 AM
Firstpage :
522
Lastpage :
524
Abstract :
We present a proof-of-principle demonstration of a low-footprint optical interconnect on a silicon-on-insulator (SOI) chip. The optical link consists of a heterogeneously integrated, InP-based microdisk laser (MDL) and microdetector, coupled to a common SOI wire waveguide. Applying an electrical current to the MDL resulted in a detector current up to 1 muA.
Keywords :
indium compounds; microdisc lasers; microsensors; optical interconnections; silicon-on-insulator; InP; SOI chip; heterogeneous integration; low footprint optical interconnect; microdetectors; microdisk lasers; optical link; proof-of-principle demonstration; Indium phosphide; Optical coupling; Optical fiber communication; Optical interconnections; Optical pumping; Optical surface waves; Optical waveguides; Photonics; Silicon on insulator technology; Waveguide lasers; Heterogeneous integration; microdisk laser (MDL); optical interconnect; silicon photonics;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2009.2014391
Filename :
4806271
Link To Document :
بازگشت