DocumentCode :
1208897
Title :
SEU-hardened silicon bipolar and GaAs MESFET SRAM cells using local redundancy techniques
Author :
Hauser, John R.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume :
39
Issue :
1
fYear :
1992
fDate :
2/1/1992 12:00:00 AM
Firstpage :
2
Lastpage :
6
Abstract :
Silicon bipolar and GaAs FET SRAMs have proven to be more difficult to harden with respect to single-event upset (SEU) mechanisms than have silicon CMOS SRAMs. This is a fundamental property of bipolar and JFET or MESFET device technologies which do not have a high-impedance, nonactive isolation between the control electrode and the current of voltage being controlled. All SEU circuit-level hardening techniques applied at the local cell level must use some type of information storage redundancy so that information loss on one node due to an SEU event can be recovered from information stored elsewhere in the cell. Several approaches to the use of local redundancy in bipolar and FET technologies are discussed. At the expense of increased cell complexity and increased power consumption and write time, several approaches are capable of providing complete SEU hardness at the local cell level
Keywords :
III-V semiconductors; SRAM chips; bipolar integrated circuits; field effect integrated circuits; gallium arsenide; radiation hardening (electronics); redundancy; GaAs; GaAs MESFET SRAM; SEU hardening; Si; bipolar SRAM; cell complexity; circuit-level hardening techniques; information loss; information storage redundancy; local cell level; local redundancy techniques; power consumption; single-event upset; write time; CMOS technology; Electrodes; FETs; Gallium arsenide; Isolation technology; MESFETs; Random access memory; Silicon; Single event upset; Voltage control;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.120128
Filename :
120128
Link To Document :
بازگشت