• DocumentCode
    1209915
  • Title

    Thermal Transient Response of GaAs FETs Under Intentional Electromagnetic Interference (IEMI)

  • Author

    Xu, Jianfeng ; Yin, Wen-Yan ; Mao, Jun-Fa ; Li, Le-Wei Joshua

  • Author_Institution
    Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
  • Volume
    50
  • Issue
    2
  • fYear
    2008
  • fDate
    5/1/2008 12:00:00 AM
  • Firstpage
    340
  • Lastpage
    346
  • Abstract
    Transient thermal responses of GaAs field-effect transistors (FETs) in the presence of an electromagnetic pulse (EMP) are investigated in this paper. The numerical methodology employed is an efficient nonlinear finite-element method (FEM) that combines the element-by-element FEM and the preconditioned conjugate gradient technique. Parametric studies are carried out to show different pulse parameters on the transient thermal responses as well as maximum channel temperatures of some typical GaAs FETs, with silicon FETs also taken into account for comparison. It is numerically proven that the thermal impact caused by medium EMP will be the most serious compared with fast EMP or ultra-wideband pulse, and the captured maximum channel temperature is proportional to the input power density, approximately of the EMP injected. This research can serve as a base for taking further protection measures to prevent on-chip device from breakdown by the attack of an EMP.
  • Keywords
    III-V semiconductors; electromagnetic interference; electromagnetic pulse; field effect transistors; finite element analysis; gallium arsenide; silicon; transient response; EMP; FET; GaAs; IEMI; conjugate gradient technique; electromagnetic pulse; field-effect transistor; finite-element method; intentional electromagnetic interference; maximum channel temperature; nonlinear FEM; on-chip device; power density; thermal transient response; EMP radiation effects; Electromagnetic interference; Electromagnetic transients; FETs; Finite element methods; Gallium arsenide; Parametric study; Silicon; Temperature; Transient response; Breakdown; GaAs field-effect transistors (FETs); electromagnetic pulses (EMPs); intentional electromagnetic interference (IEMI); maximum channel temperature; nonlinear finite-element method (FEM); silicon FET; transient thermal response;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2008.922792
  • Filename
    4510844