DocumentCode
1211163
Title
Self-Timed Regenerators for High-Speed and Low-Power On-Chip Global Interconnect
Author
Singh, Prashant ; Seo, Jae-sun ; Blaauw, David ; Sylvester, Dennis
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI
Volume
16
Issue
6
fYear
2008
fDate
6/1/2008 12:00:00 AM
Firstpage
673
Lastpage
677
Abstract
In this paper, we propose a new circuit technique called self-timed regenerator (STR) to improve both speed and power for on-chip global interconnects. The proposed circuits are placed along global wires to compensate the loss in resistive wires and to amplify the effect of wire inductance in the wires to enable transmission line like behavior. For different wire widths, the number of STR and sizing of the transistors are optimized to accelerate the signal propagation while consuming minimum power. In 90-nm CMOS technology, STR design achieved a delay improvement of 14% over the conventional repeater design. Furthermore, 20% power reduction is achieved for iso-delay, and 8% delay improvement for iso-power compared with the repeater design. The proposed technique has also been applied to a clock distribution network, reducing clock power by 26%.
Keywords
CMOS integrated circuits; delays; integrated circuit design; integrated circuit interconnections; low-power electronics; nanoelectronics; CMOS technology; STR design; circuit technique; clock distribution network; clock power reduction; conventional repeater design; high-speed on-chip global interconnect; iso-delays; low-power on-chip global interconnects; power reduction; resistive wire loss compensation; self-timed regenerators; size 90 nm; transistor sizing; transmission line like behavior; wire inductance; CMOS technology; Clocks; Delay; Distributed parameter circuits; Inductance; Integrated circuit interconnections; Power transmission lines; Propagation losses; Repeaters; Wires; Circuit; interconnect; repeaters; signaling;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2008.2000250
Filename
4511670
Link To Document