DocumentCode :
1211347
Title :
Fabrication and characterization of low-loss TFMS on silicon substrate up to 220 GHz
Author :
Six, Gonzague ; Prigent, Gaëtan ; Rius, Eric ; Dambrine, Gilles ; Happy, Henri
Author_Institution :
Inst. d´´Electronique de Microelectronique et de Nanotechnologie, Villeneuve d´´Ascq, France
Volume :
53
Issue :
1
fYear :
2005
Firstpage :
301
Lastpage :
305
Abstract :
This paper presents the results of the fabrication and characterization up to 220 GHz, of thin-film microstrip (TFMS) transmission-line structures. The transmission lines are fabricated on a low-resistivity silicon substrate (ρ=10 Ω · cm). TFMS lines with a thick dielectric layer (20 μm of benzocyclobutene is used here) present losses of 0.3 dB/mm at 94 GHz and 0.6 dB/mm at 220 GHz. Thus, using this technology, it will be possible to develop monolithic microwave integrated circuits on a silicon substrate.
Keywords :
MMIC; dielectric thin films; integrated circuit interconnections; microstrip lines; 10 ohmcm; 20 micron; 220 GHz; 94 GHz; Si; dielectric layer; low resistivity silicon substrate; monolithic microwave integrated circuits; thin film microstrip transmission line structures; transmission line fabrication; Dielectric losses; Dielectric substrates; Dielectric thin films; Fabrication; Integrated circuit technology; Microstrip; Microwave integrated circuits; Microwave technology; Silicon; Transmission lines;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2004.839915
Filename :
1381701
Link To Document :
بازگشت