Title :
Efficient frequency-domain modeling and circuit simulation of transmission lines
Author :
Silveira, L. Miguel ; Elfadel, Ibrahim M. ; White, Jacob K. ; Chilukuri, Moni ; Kundert, Kenneth S.
Author_Institution :
MIT, Cambridge, MA, USA
fDate :
11/1/1994 12:00:00 AM
Abstract :
In this paper we describe an algorithm for efficient SPICE-level simulation of transmission lines with arbitrary scattering parameter descriptions. That is, the line can be represented in the form of a frequency-domain model or a table of measured frequency-domain data. Our approach initially uses a forced stable decade-by-decade l2 minimization approach to construct a sum of rational functions approximation, but the approximation has dozens of poles and zeros. This unnecessarily high-order model is then reduced using a guaranteed stable model order reduction scheme based on balanced realizations. Once the reduced-order model is derived, it can be combined with the transmission line´s inherent delay to generate an impulse response. Finally, following what is now a standard approach, the impulse response can be efficiently incorporated in a circuit simulator using recursive convolution. An example of a transmission line with skin-effect is examined to both demonstrate the effectiveness of the approach and to show its generality
Keywords :
S-parameters; SPICE; circuit analysis computing; circuit stability; distributed parameter networks; frequency-domain analysis; packaging; skin effect; transient analysis; transient response; transmission line theory; SPICE-level simulation; arbitrary scattering parameter descriptions; balanced realizations; circuit simulation; forced stable decade-by-decade l2 minimization; frequency-domain modeling; guaranteed stable model order reduction; impulse response; recursive convolution; skin-effect; sum of rational functions approximation; transmission lines; Circuit simulation; Delay lines; Distributed parameter circuits; Frequency measurement; Function approximation; Minimization; Poles and zeros; Reduced order systems; Scattering parameters; Transmission line measurements;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on