Title :
Development of Stretch Solder Interconnections for Wafer Level Packaging
Author :
Rajoo, R. ; Lim, S.S. ; Wong, E.H. ; Hnin, W.Y. ; Seah, S.K.W. ; Tay, A.A.O. ; Iyer, Mahadevan ; Tummala, Rao R.
Author_Institution :
Inst. of Microelectron., Singapore
fDate :
5/1/2008 12:00:00 AM
Abstract :
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.
Keywords :
interconnections; solders; wafer level packaging; metallization scheme; spherical-shaped solder bumps; stretch solder interconnections; thermal cycling reliability; wafer level packaging; wafer level testing; Capacitive sensors; Costs; Metallization; Packaging; Plastics; Shape; Soldering; Testing; Thermal stresses; Wafer scale integration; Hourglass interconnect; solder joint reliability; stretch solder interconnect; temperature cycling; wafer level packaging;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.923390
