Development of Stretch Solder Interconnections for Wafer Level Packaging

Author

Rajoo, R. ; Lim, S.S. ; Wong, E.H. ; Hnin, W.Y. ; Seah, S.K.W. ; Tay, A.A.O. ; Iyer, Mahadevan ; Tummala, Rao R.

Author_Institution

Inst. of Microelectron., Singapore

Volume

31

Issue

2

fYear

2008

fDate

5/1/2008 12:00:00 AM

Firstpage

377

Lastpage

385

Abstract

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.

Keywords

interconnections; solders; wafer level packaging; metallization scheme; spherical-shaped solder bumps; stretch solder interconnections; thermal cycling reliability; wafer level packaging; wafer level testing; Capacitive sensors; Costs; Metallization; Packaging; Plastics; Shape; Soldering; Testing; Thermal stresses; Wafer scale integration; Hourglass interconnect; solder joint reliability; stretch solder interconnect; temperature cycling; wafer level packaging;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2008.923390

Filename

4512111